Embedded Die Packaging Technology Market Revenue to Cross US$ 242.80 Million by 2028: The Insight Partners

November 30 16:15 2021
Embedded Die Packaging Technology Market Revenue to Cross US$ 242.80 Million by 2028: The Insight Partners
The Insight Partners
Growing Demand for Miniaturization of Electronic Devices to Provide Growth Opportunities for Embedded Die Packaging Technology Market

According to our latest market study on “Embedded Die Packaging Technology Market Forecast to 2028 – COVID-19 Impact and Global Analysis – by Platform, Application, Industry Vertical, and Geography,” the market was valued at US$ 63.40 million in 2020 and is projected to reach US$ 242.80 million by 2028; it is expected to grow at a CAGR of 18.6% during the forecast period of 2021 to 2028.

Strategic Insights        

Report Coverage


Market Size Value in

 US$ 63.40 Million in 2020

Market Size Value by

 US$ 242.80 Million by 2028

Growth rate

 CAGR of 18.6% from 2021-2028

Forecast Period


Base Year


No. of Pages


No. Tables


No. of Charts & Figures


Historical data available


Segments covered

 Platform, Application, and Industry, Geography

Regional scope

 North America; Europe; Asia Pacific; Latin America; MEA

Country scope

 US, UK, Canada, Germany, France, Italy, Australia, Russia, China, Japan, South Korea, Saudi Arabia, Brazil, Argentina

Report coverage

 Revenue forecast, company ranking, competitive landscape, growth factors, and trends


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Growing trend of the small form factor based handheld electronic devices is one of the major factors, which is accelerating the market growth. The technological advancements in electronics manufacturing, such as miniaturization, have influenced various markets, including military, aerospace, medical, media, retail, and consumer electronics. The devices with small form factor-based packages embed more functionality. They are becoming an alternative for traditional packaging systems. Personalized healthcare gadgets, thin sized smartphones, compact PCs, and other devices are designed with embedded die packaging technology-based components, such as processor, sensors, RF modules, and others. Continuous developments in advanced packaging technologies, such as IC package substrate and flexible board, are further boosting the device performance by resolving the technical challenges. This, in turn, is driving the embedded die packaging technology market.

Geographically, Asia Pacific held the largest share of the embedded die packaging technology market in 2020, followed by North America and Europe. Further, North America is projected to witness the highest growth rate during the forecast period. The embedded die packaging technology market is segmented into platform, application, industry vertical, and geography. Based on platform, the embedded die packaging technology market is further categorized into IC package substrate, rigid board, and flexible board. Based on application, the embedded die packaging technology market is further segmented into smartphones & tablets, medical and wearable devices, industrial devices, and security devices. Based on industry, the embedded die packaging technology market is further segmented into automotive, healthcare, consumer electronics, IT & telecommunication, and others.

Impact of COVID-19 Pandemic on Embedded Die Packaging Technology Market

The COVID-19 pandemic has hampered the semiconductor industry and economic growth of almost every country. The pandemic has severely impacted the manufacturing sector due to shutdown of facilities for a certain period. Sales of various industrial products, such as automotive cars and electronics, was declined. Office premises, public places, schools, transportation, and other spaces also remained closed which declined market growth owing to low sale. 

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Growing Demand for Miniaturization of Electronic Devices

Electronics gadgets are being developed using small form factor electronic components to enhance the space and improve the final product design. Customers are preferring compact, small-sized handheld electronic devices offering maximum features. To enhance user experience, companies are developing miniaturized electronics to integrate maximum components on a single die. Integrating maximum number of components, such as sensors and processor, in a single die offers enhanced features for customers. Rising techno savvy population is one the major factors for the miniaturization of electronics as it has created stiff competition in market players to offer maximum number of features in a single device.

Embedded Die Packaging Technology Market: Application

In terms of application, the global embedded die packaging technology market is segmented into smartphones & tablets, medical and wearable devices, industrial devices, security devices, and others. The emerging need of microelectronics from various industry verticals, including automotive, healthcare, and consumer electronics, for small-form factor-based applications are supporting the market growth. Growing trend of size reduction and improving functionality of electronic devices are boosting the adoption of embedded die packaging technology for cellphones and tablets. The die and chip size play a vital role in a smartphone design, as manufacturers are urging for a new solution to take the minimum space possible.

Embedded Die Packaging Technology Market: Competitive Landscape and Key Developments

ASE Group; Microsemi; General Electric Company; Taiwan Semiconductor Manufacturing Company, Limited; Fujikura Ltd.; Shinko Electric Industries Co., Ltd.; Schweizer Electronic AG; Amkor Technology, Inc.; Infineon Technologies Ag; and AT & S Austria Technologie & Systemtechnik Aktiengesellschaft are among the key players in the global Embedded Die Packaging Technology market. The leading companies focus on the expansion and diversification of their market presence, and acquisition of new customer base, thereby tapping prevailing business opportunities.

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In August 2020, Schweizer Electronic AG formed sales representative agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and embedding solutions in South Korea.

In August 2020, Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) launched new 3D silicon tacking and advanced packaging technology.

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